The global blister packaging market was estimated at $28.7 billion in 2023 and is projected to reach $46.7 billion by 2030, growing at a CAGR of 7.2% from 2024 to 2030. Grand View Research notes that the development of eco-friendly and recyclable blister packaging has addressed sustainability concerns, thus contributing to this market growth. Aluminum-free and mono-material blister packaging designs are being pursued by companies like TOPPAN and IWK Packaging Systems. Meanwhile, ACG is offering an alternative to co-extruded structures with its proprietary lamination-based approach. Check out these innovations below.
TOPPAN Acquires Asahi Kasei’s Patented Brittle Lidding Material Technology
Image Credit: TOPPAN Holdings
TOPPAN Holdings Inc. (TOPPAN Holdings) has reached an agreement to acquire Asahi Kasei Corporation’s patented technology related to brittle lidding material for push-through blister packs, completing the transfer on November 28.
New Machine Produces 100% Cardboard Blister Packaging
Image provided by IWK Packaging Systems, Inc.
IWK Packaging Systems, Inc., a manufacturer of premium tube filling and cartoning equipment for the pharmaceutical, health and beauty sectors, has introduced to the North American market a machine that produces fully cardboard blisters — including both the base card and blister itself.
Desiccant-Based Cold-Form Laminate Protects Moisture-Sensitive Pharmaceutical Blisters
Image provided by ACG
ACG, the world’s most integrated provider of solid-dosage and packaging solutions, announces the launch of DryPod™, a next-generation, desiccant-based, cold-form laminate engineered to protect highly moisture-sensitive drug molecules. DryPod™ marks a major advancement for pharmaceutical manufacturers.
